DocumentCode :
3788003
Title :
Foreword Special Issue on Tin Whiskers
Author :
R.W. Gedney
Volume :
28
Issue :
1
fYear :
2005
Firstpage :
2
Lastpage :
2
Keywords :
"Tin","Components, Packaging, and Manufacturing Technology Society","Switches","Coatings","Lead","Electronics packaging","Zinc","Pulp manufacturing","Semiconductor device packaging","Electronics industry"
Journal_Title :
IEEE Transactions on Electronics Packaging Manufacturing
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.847813
Filename :
1430803
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3788003
