DocumentCode
3788588
Title
Advances in electronic circuit packaging, vol. 5
Author
T.D. Schlabach
Author_Institution
Bell Telephone Labs., Inc., Murray Hill, N.J.
Volume
53
Issue
12
fYear
1965
Firstpage
2171
Lastpage
2171
Keywords
"Electronic circuits","Electronics packaging","Books","Libraries","Publishing","Electronics cooling","Heat transfer","Magnetic analysis","Art","Transfer molding"
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1965.4563
Filename
1446493
Link To Document