DocumentCode :
3788588
Title :
Advances in electronic circuit packaging, vol. 5
Author :
T.D. Schlabach
Author_Institution :
Bell Telephone Labs., Inc., Murray Hill, N.J.
Volume :
53
Issue :
12
fYear :
1965
Firstpage :
2171
Lastpage :
2171
Keywords :
"Electronic circuits","Electronics packaging","Books","Libraries","Publishing","Electronics cooling","Heat transfer","Magnetic analysis","Art","Transfer molding"
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/PROC.1965.4563
Filename :
1446493
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3788588
