Title :
Micromachined e-jet for IC chip cooling
Author :
Tsung-Kuan, A. ; Chou ; Najafi, K. ; Muller, M.O. ; Bernal, L.P. ; Washabaugh, P.D. ; Parviz, B.A.
Author_Institution :
Center for Wireless Integrated MicroSystems, Michigan Univ., Ann Arbor, MI, USA
Abstract :
The authors present a micromachined acoustic ejector (MACE) chip which contains electrostatically-driven Helmholtz resonators that generate small air jets. A 1.6×1.6 cm/sup 2/ prototype contains 25 e-jets with 1 m/s measured velocity. Results show that a 15-jet device located ∼1 cm above a 100°C surface dissipates >6W/m/sup 2/ K. Future generations are being designed with higher jet velocity.
Keywords :
cooling; integrated circuit packaging; jets; micromechanical resonators; thermal management (packaging); 1 m/s; IC chip cooling; electrostatically-driven Helmholtz resonators; high speed air jets; micromachined acoustic ejector chip; Acoustic devices; Aerosols; Aerospace engineering; Biomembranes; Cooling; Heat pumps; Heat sinks; Resonance; Silicon; Testing;
Conference_Titel :
Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7335-9
DOI :
10.1109/ISSCC.2002.993079
