Title :
3-D integrable optoelectronic devices for telecommunications ICs
Author :
Dainesi, P. ; Ionescu, A.M. ; Thevenaz, L. ; Banerjee, K. ; Declercq, M.J. ; Robert, P. ; Renaud, P. ; Fluckiger, P. ; Hibert, C. ; Racine, G.A.
Author_Institution :
Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Abstract :
3-D integrable SOI optoelectronic devices include telecommunication optical switches with 5 MHz bandwidth and unbalanced Mach Zehnder interferometers for filtering. Thermal compensation provides efficient modulation over 100 kHz -1 MHz and addresses 3-D IC thermal issues.
Keywords :
CMOS integrated circuits; Mach-Zehnder interferometers; compensation; integrated optoelectronics; photonic switching systems; silicon-on-insulator; telecommunication equipment; 100 kHz to 1 MHz; 3D IC thermal issues; 3D integrable optoelectronic device; 5 MHz; SOI optoelectronic devices; Si; photonic ICs; telecommunication optical switches; telecommunications ICs; thermal compensation; unbalanced Mach Zehnder interferometers; Nonlinear optics; Optical filters; Optical interferometry; Optical modulation; Optical receivers; Optical refraction; Optical variables control; Optoelectronic devices; Silicon; Switches;
Conference_Titel :
Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7335-9
DOI :
10.1109/ISSCC.2002.993081
