مرکز منطقه ای اطلاع رساني علوم و فناوري - Introduction to the Special Issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DocumentCode :

3789828

Title :

Introduction to the Special Issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Author :

K.L. Pey;A. Trigg;S. Chung

Volume :

Issue :

fYear :

2005

Firstpage :

167

Lastpage :

167

Keywords :

"Special issues and sections","Failure analysis","Integrated circuit reliability","Dielectric devices","Copper","Radio frequency","Semiconductor device packaging","Hot carriers","Paper technology","Dielectric breakdown"

Journal_Title :

IEEE Transactions on Device and Materials Reliability

Publisher :

ieee

ISSN :

1530-4388

Type :

jour

DOI :

10.1109/TDMR.2005.849903

Filename :

1458729

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3789828