• DocumentCode
    3789828
  • Title

    Introduction to the Special Issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

  • Author

    K.L. Pey;A. Trigg;S. Chung

  • Volume
    5
  • Issue
    2
  • fYear
    2005
  • Firstpage
    167
  • Lastpage
    167
  • Keywords
    "Special issues and sections","Failure analysis","Integrated circuit reliability","Dielectric devices","Copper","Radio frequency","Semiconductor device packaging","Hot carriers","Paper technology","Dielectric breakdown"
  • Journal_Title
    IEEE Transactions on Device and Materials Reliability
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2005.849903
  • Filename
    1458729
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3789828