مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3790316

Title :

Foreword Three-Dimensional Packaging

Author :

C.E. Bauer;S.W.R. Lee

Volume :

Issue :

fYear :

2005

Firstpage :

354

Lastpage :

355

Keywords :

"Silicon","Electronic packaging thermal management","Stacking","Integrated circuit interconnections","Electronics packaging","Through-silicon vias","Sensor arrays","Fabrication","Thermal resistance","Copper"

Journal_Title :

IEEE Transactions on Advanced Packaging

Publisher :

ieee

ISSN :

1521-3323

Type :

jour

DOI :

10.1109/TADVP.2005.855361

Filename :

1492503

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3790316