• DocumentCode
    3790427
  • Title

    Foreword Special Section on ITherm 2004 Mechanics Track

  • Author

    K. Ramakrishna;B.G. Sammakia;J.H.L. Pang;K. Jonnalagadda

  • Volume
    28
  • Issue
    3
  • fYear
    2005
  • Firstpage
    387
  • Lastpage
    389
  • Keywords
    "Environmentally friendly manufacturing techniques","Lead","Thermal management","Thermomechanical processes","Electronic packaging thermal management","Electronics packaging","Plastic packaging","Copper","Fatigue","Soldering"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.856050
  • Filename
    1501937
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3790427