DocumentCode :
3790722
Title :
Foreword Polytronic Special Section
Author :
J.E. Morris
Volume :
28
Issue :
4
fYear :
2005
Firstpage :
289
Lastpage :
290
Keywords :
"Components, Packaging, and Manufacturing Technology Society","Components, packaging, and manufacturing technology","Optical polymers","Thermomechanical processes","Optical interconnections","Optical waveguides","Conductive adhesives","Paper technology","Electronics packaging","Computer aided manufacturing"
Journal_Title :
IEEE Transactions on Electronics Packaging Manufacturing
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.859770
Filename :
1522481
Link To Document :
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