• DocumentCode
    3790784
  • Title

    Foreword Special Section on Micro- and Nanoscale Packaging

  • Author

    Y.C. Lee;J.A. Chiou;T. Velten;W.O. Hancock

  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    531
  • Lastpage
    532
  • Keywords
    "Packaging","Nanobioscience","Micromechanical devices","Nanoscale devices","Micromotors","Wafer bonding","Biomedical optical imaging","Protein engineering","Microfluidics","Nanoelectromechanical systems"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.860786
  • Filename
    1528634
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3790784