DocumentCode :
3790784
Title :
Foreword Special Section on Micro- and Nanoscale Packaging
Author :
Y.C. Lee;J.A. Chiou;T. Velten;W.O. Hancock
Volume :
28
Issue :
4
fYear :
2005
Firstpage :
531
Lastpage :
532
Keywords :
"Packaging","Nanobioscience","Micromechanical devices","Nanoscale devices","Micromotors","Wafer bonding","Biomedical optical imaging","Protein engineering","Microfluidics","Nanoelectromechanical systems"
Journal_Title :
IEEE Transactions on Advanced Packaging
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2005.860786
Filename :
1528634
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3790784
