مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3790910

Title :

Foreword Polytronic Special Section

Author :

J.E. Morris

Volume :

Issue :

fYear :

2005

Firstpage :

741

Lastpage :

741

Keywords :

"Components, Packaging, and Manufacturing Technology Society","Polymers","Electronics packaging","Costs","Encapsulation","Printed circuits","Integrated circuit interconnections","Microelectronics","Photonics"

Journal_Title :

IEEE Transactions on Components and Packaging Technologies

Publisher :

ieee

ISSN :

1521-3331

Type :

jour

DOI :

10.1109/TCAPT.2005.859661

Filename :

1546183

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3790910