3791256

Guest Editorial Contributions From the 13th Topical Meeting on Electrical Performance of Electronic Packaging

R.W. Jackson;M. Cases

29

1

2006

3

4

"Electronics packaging","Educational institutions","High-speed electronics","Electromagnetic modeling","Conference proceedings","Components, packaging, and manufacturing technology","Microwave devices","Millimeter wave integrated circuits","Integrated circuit modeling"

IEEE Transactions on Advanced Packaging

ieee

1521-3323

jour

10.1109/TADVP.2005.862642

1589126