DocumentCode :
3791830
Title :
Correction to "A Novel Joint-in-Via Flip-Chip Chip-Scale Package"
Author :
T.K. Lee;S. Zhang;C.C. Wong;A.C. Tan
Volume :
29
Issue :
2
fYear :
2006
Firstpage :
372
Lastpage :
372
Keywords :
"Chip scale packaging","Semiconductor device packaging","Biographies","Substrates","Mechanical engineering","Materials science and technology","Electronics packaging","Microelectronics","Micromechanical devices","Asia"
Journal_Title :
IEEE Transactions on Advanced Packaging
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2006.873918
Filename :
1629181
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3791830
