3791952

Foreword Special Section on ITherm 2004: Emerging Technologies

K. KoneruRamakrishna;B.G. BahgatG.Sammakia;S. SandeepTonapi

29

2

2006

235

237

"Thermal conductivity","Thermal management","Semiconductor device packaging","Nanostructured materials","USA Councils","Laser excitation","Pump lasers","Conducting materials","Boltzmann equation","Semiconductor laser arrays"

IEEE Transactions on Components and Packaging Technologies

ieee

1521-3331

jour

10.1109/TCAPT.2006.877174

1637753