DocumentCode
3791952
Title
Foreword Special Section on ITherm 2004: Emerging Technologies
Author
K. KoneruRamakrishna;B.G. BahgatG.Sammakia;S. SandeepTonapi
Volume
29
Issue
2
fYear
2006
Firstpage
235
Lastpage
237
Keywords
"Thermal conductivity","Thermal management","Semiconductor device packaging","Nanostructured materials","USA Councils","Laser excitation","Pump lasers","Conducting materials","Boltzmann equation","Semiconductor laser arrays"
Journal_Title
IEEE Transactions on Components and Packaging Technologies
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2006.877174
Filename
1637753
Link To Document