• DocumentCode
    3791952
  • Title

    Foreword Special Section on ITherm 2004: Emerging Technologies

  • Author

    K. KoneruRamakrishna;B.G. BahgatG.Sammakia;S. SandeepTonapi

  • Volume
    29
  • Issue
    2
  • fYear
    2006
  • Firstpage
    235
  • Lastpage
    237
  • Keywords
    "Thermal conductivity","Thermal management","Semiconductor device packaging","Nanostructured materials","USA Councils","Laser excitation","Pump lasers","Conducting materials","Boltzmann equation","Semiconductor laser arrays"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.877174
  • Filename
    1637753