3793512

Introduction to the Special Issue on the IEEE International Symposium on Physical and Failure Analysis of Integrated Circuits

C.H. Tung;J.M. Chin;S. Lim

6

2

2006

181

181

"Special issues and sections","Failure analysis","Scanning electron microscopy","Atomic force microscopy","Integrated circuit reliability","Transmission electron microscopy","Integrated circuit packaging","Semiconductor device packaging","Semiconductor device manufacture","Spectroscopy"

IEEE Transactions on Device and Materials Reliability

ieee

1530-4388

jour

10.1109/TDMR.2006.877203

1673707