DocumentCode :
3793988
Title :
Open Forum Editorial
Author :
M.G. Michael;G. Pecht
Volume :
29
Issue :
3
fYear :
2006
Firstpage :
702
Lastpage :
702
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.882494
Filename :
1684195
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3793988
