DocumentCode :
3798494
Title :
The Future of DEIS [Editorial]
Author :
John Densley
Volume :
23
Issue :
1
fYear :
2007
Firstpage :
3
Lastpage :
3
Keywords :
"Dielectrics and electrical insulation","Societies","Manufacturing","Power engineering and energy","Dielectric materials","Educational institutions","North America","Power engineering","Europe","Superconducting materials"
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2007.288449
Filename :
4068206
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3798494
