DocumentCode :
3799182
Title :
Prolog to Wafer Direct Bonding: From Advance Substrate Engineering to Future Applications in Micro/Nanoelectronics
Author :
Jim Esch
Volume :
94
Issue :
12
fYear :
2006
Firstpage :
2058
Lastpage :
2059
Keywords :
"Wafer bonding","Nanoelectronics","Silicon on insulator technology","Plasma temperature","Substrates","Surface cleaning","Hydrogen","Bonding forces","Annealing","Fabrication"
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2006.888852
Filename :
4077256
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3799182
