• DocumentCode
    379932
  • Title

    Modeling the elastic constants & toughness of dental restorative composites

  • Author

    Mahanti, Subhadra ; Wu, Wei ; Baran, George ; Sadeghipour, Keya

  • Author_Institution
    Dept. of Mech. Eng., Temple Univ., Philadelphia, PA, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    107
  • Lastpage
    108
  • Abstract
    Although dental amalgam continues to be the most widely used posterior restorative material, the preferred material based on aesthetic considerations is the polymer-based dental composite. Fracture and wear failure are among the most frequent reasons for replacing composite restorations in permanent teeth. Thus in order to improve the properties and behavior of posterior dental composites, we have to make efforts toward creating additional toughening mechanisms. One method for achieving this goal is to investigate the stress distribution around the filler/matrix interface or interphase by varying parameters such as the volume fraction of filler, the particle size and the modulus of the filler
  • Keywords
    Young´s modulus; biomechanics; biomedical materials; brittle fracture; composite material interfaces; dentistry; elastic constants; filled polymers; finite element analysis; fracture mechanics; fracture toughness; internal stresses; particle size; wear; Young´s modulus; additional toughening mechanisms; brittle failure modes; contraction; crack tip; critical energy release rate; dental restorative composites; elastic constants; energy dissipation; filler volume fraction; filler/matrix interface; fracture toughness; glass-bead filled epoxy; linear fracture mechanics; notched plane strain composite; particle size; particulate-filled epoxy materials; polymer-based dental composite; polymerization; posterior dental composites; residual stresses; spherical cell finite-element model; stress distribution; virtual crack growth; von Mises stress; wear failure; Capacitive sensors; Composite materials; Dentistry; Fatigue; Iron; Mechanical factors; Plastics; Polymers; Resins; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioengineering Conference, 2002. Proceedings of the IEEE 28th Annual Northeast
  • Conference_Location
    Philadelphia, PA
  • Print_ISBN
    0-7803-7419-3
  • Type

    conf

  • DOI
    10.1109/NEBC.2002.999488
  • Filename
    999488