DocumentCode
379932
Title
Modeling the elastic constants & toughness of dental restorative composites
Author
Mahanti, Subhadra ; Wu, Wei ; Baran, George ; Sadeghipour, Keya
Author_Institution
Dept. of Mech. Eng., Temple Univ., Philadelphia, PA, USA
fYear
2002
fDate
2002
Firstpage
107
Lastpage
108
Abstract
Although dental amalgam continues to be the most widely used posterior restorative material, the preferred material based on aesthetic considerations is the polymer-based dental composite. Fracture and wear failure are among the most frequent reasons for replacing composite restorations in permanent teeth. Thus in order to improve the properties and behavior of posterior dental composites, we have to make efforts toward creating additional toughening mechanisms. One method for achieving this goal is to investigate the stress distribution around the filler/matrix interface or interphase by varying parameters such as the volume fraction of filler, the particle size and the modulus of the filler
Keywords
Young´s modulus; biomechanics; biomedical materials; brittle fracture; composite material interfaces; dentistry; elastic constants; filled polymers; finite element analysis; fracture mechanics; fracture toughness; internal stresses; particle size; wear; Young´s modulus; additional toughening mechanisms; brittle failure modes; contraction; crack tip; critical energy release rate; dental restorative composites; elastic constants; energy dissipation; filler volume fraction; filler/matrix interface; fracture toughness; glass-bead filled epoxy; linear fracture mechanics; notched plane strain composite; particle size; particulate-filled epoxy materials; polymer-based dental composite; polymerization; posterior dental composites; residual stresses; spherical cell finite-element model; stress distribution; virtual crack growth; von Mises stress; wear failure; Capacitive sensors; Composite materials; Dentistry; Fatigue; Iron; Mechanical factors; Plastics; Polymers; Resins; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioengineering Conference, 2002. Proceedings of the IEEE 28th Annual Northeast
Conference_Location
Philadelphia, PA
Print_ISBN
0-7803-7419-3
Type
conf
DOI
10.1109/NEBC.2002.999488
Filename
999488
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