• DocumentCode
    3806685
  • Title

    TCPT-2006-096.R2: Micro Scale pin fin Heat Sinks —Parametric Performance Evaluation Study

  • Author

    Ali Kosar;Yoav Peles

  • Author_Institution
    Sabanci Univ., Istanbul
  • Volume
    30
  • Issue
    4
  • fYear
    2007
  • Firstpage
    855
  • Lastpage
    865
  • Abstract
    A parametric study of heat transfer and pressure drop associated with forced flow of deionized water over five micro pin fin heat sinks of different spacing, arrangements, and shapes was conducted experimentally. Nusselt numbers and friction factors were obtained over Reynolds numbers ranging from 14 to 720. The thermal and hydraulic results were obtained to evaluate and compare the heat sinks performances at fixed mass flow rate, fixed pressure drop, and fixed pumping power. Two distinct regions of the Nusselt number dependency on the Reynolds number separated by a critical Reynolds number have been identified for unstreamlined pin fin devices while the streamlined device showed no slope change. The effects of spacing, shape of pin fins, and arrangement on friction factor and heat transfer were in agreement with existing literature. The results indicate that utilizing streamlined pin fin heat sinks can significantly enhance the thermal-hydraulic performance of the heat sink, but only at moderate Reynolds numbers.
  • Keywords
    "Heat sinks","Heat transfer","Thermal resistance","Thermal conductivity","Electric resistance","Temperature","Silicon","Electronic packaging thermal management","Water heating","Shape"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2007.906334
  • Filename
    4358424