DocumentCode :
3807222
Title :
The Future of DEIS - Editorial
Author :
John Densley
Volume :
24
Issue :
1
fYear :
2008
Firstpage :
3
Lastpage :
3
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2008.4455496
Filename :
4455496
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3807222
