DocumentCode :
3807484
Title :
Dynamics of the Profile Charging During $\hbox{SiO}_{2}$ Etching in Plasma for High Aspect Ratio Trenches
Author :
Branislav M. Radjenovic;Marija D. Radmilovic-Radjenovic;Zoran Lj. Petrovic
Author_Institution :
Inst. of Phys., Belgrade
Volume :
36
Issue :
4
fYear :
2008
Firstpage :
874
Lastpage :
875
Abstract :
We model charging of the high aspect ratio 3-D trenches during plasma etching of dielectrics. The ion and electron fluxes were computed along the feature using Monte Carlo method. The surface potential profiles and electric field for the entire feature were generated by solving Poisson equation using finite-element method.
Keywords :
"Etching","Electrons","Plasma applications","Distribution functions","Surface charging","Poisson equations","Plasma materials processing","Insulation","Plasma devices","Dielectrics"
Journal_Title :
IEEE Transactions on Plasma Science
Publisher :
ieee
ISSN :
0093-3813
Type :
jour
DOI :
10.1109/TPS.2008.920886
Filename :
4493424
Link To Document :
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