DocumentCode :
380813
Title :
Development of BION™ technology for functional electrical stimulation: hermetic packaging
Author :
Singh, J. ; Peck, R.A. ; Loeb, G.E.
Author_Institution :
A.E. Mann Inst. for Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
1313
Abstract :
BIONs™ are chronically implanted, individually addressable, single channel electrical stimulators that are now in clinical trials. They receive power and command signals from an externally worn RF transmission coil. The electronic circuitry is packaged in a glass capsule that can be injected through a hypodermic needle to provide distributed multichannel FES systems. The small size (2 mm OD × 16 mm long), external electrodes and long design life (>10 years) pose a challenge for hermetic sealing and testing. We here describe several novel packaging techniques that have been integrated into a single workstation to enable efficient and reliable production of BION implants.
Keywords :
bioelectric phenomena; biomedical electronics; coils; neuromuscular stimulation; prosthetics; semiconductor device packaging; 10 yr; 16 mm; 2 mm; BION™ technology development; chronically implanted individually addressable single channel electrical stimulators; clinical trials; design life; distributed multichannel FES systems; electronic circuitry; external electrodes; externally worn RF transmission coil; glass capsule; hermetic sealing; hypodermic needle; neural prostheses; packaging techniques; reliable production; single workstation; Circuits; Clinical trials; Coils; Electrodes; Electronics packaging; Glass; Needles; Neuromuscular stimulation; RF signals; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2001. Proceedings of the 23rd Annual International Conference of the IEEE
ISSN :
1094-687X
Print_ISBN :
0-7803-7211-5
Type :
conf
DOI :
10.1109/IEMBS.2001.1020437
Filename :
1020437
Link To Document :
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