DocumentCode :
38086
Title :
Fabrication, Characterization, and Physical Analysis of AlGaN/GaN HEMTs on Flexible Substrates
Author :
Defrance, Nicolas ; Lecourt, Francois ; Douvry, Y. ; Lesecq, Marie ; Hoel, Virginie ; Lecavelier des Etangs-Levallois, Aurelien ; Cordier, Yvon ; Ebongue, A. ; De Jaeger, J.C.
Author_Institution :
Cite Sci., Inst. of Electron., Microelectron. & Nanotechnol. (IEMN), Villeneuve d´Ascq, France
Volume :
60
Issue :
3
fYear :
2013
fDate :
Mar-13
Firstpage :
1054
Lastpage :
1059
Abstract :
This paper reports on the dc analysis and radio frequency (RF) characterization of a flexible AlGaN/GaN high-electron mobility transistor with a 120-nm gate length. The device provides a maximum dc current density of 470 mA/mm and a peak extrinsic transconductance of 125 mS/mm under flat condition. When the substrate is bent with 0.88% strain, a rise in the 2-DEG density is experimentally observed through the diminution of the on-resistance. This phenomenon is physically attributed to the modification of the piezoelectric field within the barrier under tensile condition. The device also shows a current gain cutoff frequency (Ft) of 32 GHz and a power gain cutoff frequency (Fmax) of 52 GHz. No major variations of RF performance are observed under bending.
Keywords :
III-V semiconductors; aluminium compounds; current density; gallium compounds; high electron mobility transistors; microwave field effect transistors; millimetre wave field effect transistors; piezoelectric devices; piezoelectric semiconductors; piezoelectricity; two-dimensional electron gas; wide band gap semiconductors; 2-DEG density; AlGaN-GaN; DC analysis; HEMT; RF characterization; barrier under tensile condition; bending; current gain cutoff frequency; flexible high-electron mobility transistor; flexible substrate; frequency 32 GHz; frequency 52 GHz; maximum DC current density; on-resistance diminution; peak extrinsic transconductance; physical analysis; piezoelectric field modification; power gain cutoff frequency; radiofrequency characterization; size 120 nm; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Silicon; Substrates; Electrical characterization; GaN; flexible substrate; high-electron mobility transistors (HEMTs); strain;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2238943
Filename :
6425450
Link To Document :
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