Title :
28 nm 50% Power-Reducing Contacted Mask Read Only Memory Macro With 0.72-ns Read Access Time Using 2T Pair Bitcell and Dynamic Column Source Bias Control Technique
Author :
Umemoto, Yuya ; Nii, Koji ; Ishikawa, Jun ; Yabuuchi, M. ; Okamoto, K. ; Tsukamoto, Yuya ; Tanaka, Shoji ; Tanaka, Kiyoshi ; Matsumura, Takeshi ; Mori, Kazuo ; Yanagisawa, Kei
Author_Institution :
Renesas Electron. Corp., Tokyo, Japan
Abstract :
We propose a new 2T mask read only memory (ROM) with dynamic column source bias control technique, which enables achieving both high-speed operation and low power consumption. It is also possible to overcome the inherent problem of crosstalk between the bitlines. The fabricated 128-kb ROM macro using 28-nm high- k and metal-gate CMOS bulk technology realizes 0.72 ns read access time at the typical 0.85-V supply voltage, which is comparable to that of recent high-speed embedded static random access memories. The measured dynamic power dissipation is reduced by 50% compared to the conventional 2T ROM. The standby leakage can also be reduced to half that of conventional macros.
Keywords :
CMOS integrated circuits; high-k dielectric thin films; read-only storage; 2T mask ROM; 2T mask read only memory; 2T pair bitcell; bitlines; crosstalk; dynamic column source bias control technique; high-k CMOS bulk technology; high-speed embedded static random access memories; metal-gate CMOS bulk technology; power-reducing contacted mask read only memory macro; read access time; size 28 nm; standby leakage; storage capacity 128 Kbit; time 0.72 ns; voltage 0.85 V; 28 nm; 2T read only memory (ROM) bitcell; CMOS; embedded ROM; high speed; low-power source bias control; memory;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2013.2246201