Micro-scratch inspection system for semiconductor process by two-ways laser scattering method

Author

Ishimaru, Ichiro ; Noguchi, M.

Author_Institution

Dept. of Intelligent Mech. Syst. Eng., Kagawa Univ., Takamatsu

Volume

3

fYear

2002

fDate

2002

Firstpage

2150

Abstract

CMP (Chemical Mechanical Polishing) is a key technology in semiconductor processing. However, when a problem arises in the polishing conditions, scratches are caused and yield can deteriorate drastically. We study the characteristic figure of scratch the depth of which is extremely shallow compared with width. We propose a 2-way illumination comparative discrimination method. By experiment, we obtain a good discrimination ratio between scratch and particle on unpatterned dummy wafers.

Keywords

chemical mechanical polishing; flaw detection; inspection; integrated circuit measurement; light scattering; measurement by laser beam; process monitoring; CMP; characteristic figure of scratch; chemical mechanical polishing; defect discrimination; discrimination ratio; micro-scratch inspection system; scratch particle discrimination; semiconductor process; two-way laser scattering method; unpatterned dummy wafers; yield deterioration; Chemical lasers; Chemical processes; Chemical technology; Inspection; Lighting; Particle scattering; Production engineering; Semiconductor films; Semiconductor lasers; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Control and Automation, 2002. Proceedings of the 4th World Congress on

Print_ISBN

0-7803-7268-9

Type

conf

DOI

10.1109/WCICA.2002.1021466

Filename

1021466