DocumentCode :
381261
Title :
Environmentally friendly, high thermal resistant, low CTE substrate material for semiconductor packaging
Author :
Baba, Takayuki
Author_Institution :
Circuitry Mater. Res. Lab., Sumitomo Bakelite Co. Ltd., Shizuoka, Japan
fYear :
2002
fDate :
2002
Firstpage :
389
Lastpage :
390
Abstract :
Semiconductor packaging technology has been moving towards increased miniaturization, lighter weight and higher density. Flip Chip packaging is therefore becoming the mainstream packaging technology for next generation devices. The technology trend has been moving towards much finer pitch interconnections between the semiconductor chip and the package substrate, much narrower circuit width on the substrate and a much smaller diameter of the circuitry layer interconnection. Thus, concerns arise regarding mechanical and electrical deterioration and failure at the interconnections. Previously much more focus had been placed on systems utilizing Halogen-free and Pb-free raw materials in order to meet environmental requirements. In this paper, we are reporting a new substrate material for semiconductor packages (Copper-clad-laminate: ELC-4785GS, Prepreg: EI-6785GS, Build-up material: APL-4601) which Sumitomo Bakelite has begun developing.
Keywords :
environmental factors; failure analysis; fine-pitch technology; flip-chip devices; semiconductor device packaging; substrates; thermal expansion; thermal resistance; coefficient of thermal expansion; environmental friendliness; failure analysis; fine pitch interconnection; flip-chip packaging; semiconductor packaging; substrate material; thermal resistance; Gold; Integrated circuit interconnections; Materials reliability; Resins; Semiconductor device packaging; Semiconductor device reliability; Semiconductor materials; Substrates; Temperature; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Print_ISBN :
0-7803-7301-4
Type :
conf
DOI :
10.1109/IEMT.2002.1032785
Filename :
1032785
Link To Document :
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