• DocumentCode
    381788
  • Title

    A microfabrication strategy for cylindrical ion trap mass spectrometer arrays

  • Author

    Peddanenikalva, Himani ; Potluri, Kiran ; Bhansal, Shekhar ; Short, R. Timothy ; Fries, David

  • Author_Institution
    Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
  • Volume
    1
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    651
  • Abstract
    This paper presents a microfabrication process for the realization of miniature cylindrical ion trap mass spectrometers, based on silicon MEMS technologies. In order to create these traps, several techniques are presented. Porous silicon etching technique resulting in vertical holes has been used to fabricate end-plates. The ring electrode (hole diameter 1.5 mm) has been fabricated using ultrasonic mechanical drill technique. Deep reactive ion etching (DRIE) was also used for fabrication of both ring electrode arrays and end-plate holes. The surfaces of the ring electrode and the end-plates have been made conducting by n+ doping. CYTOP films have been used both as a bonding layer and an insulator to bond the ring electrode to end-plates while ensuring electrical isolation. The thickness of CYTOP films has been chosen to ensure that it can withstand voltages up to 200 V while maintaining its bond strength.
  • Keywords
    elemental semiconductors; mass spectrometers; micromechanical devices; particle traps; polymer films; porous semiconductors; silicon; sputter etching; 0 to 200 V; 1.5 mm; CYTOP films; MEMS technologies; Si; bonding layer; cyclized perfluoro polymer; cylindrical ion trap mass spectrometer arrays; deep reactive ion etching; end-plates; etching technique; microfabrication strategy; n+ doping; ring electrode; ultrasonic mechanical drill technique; vertical holes; Bonding; Dielectrics and electrical insulation; Doping; Electrodes; Etching; Fabrication; Mass spectroscopy; Micromechanical devices; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2002. Proceedings of IEEE
  • Print_ISBN
    0-7803-7454-1
  • Type

    conf

  • DOI
    10.1109/ICSENS.2002.1037178
  • Filename
    1037178