DocumentCode
381816
Title
Simulation of characteristic of comb-gimbal micromachined gyroscope
Author
Che, Lufeng ; Xiong, Bin ; Wang, Yuelin
Author_Institution
State Key Lab of Transducer Technol., Shanghai Inst. of Microsystem & Inf. Technol., China
Volume
2
fYear
2002
fDate
2002
Firstpage
1095
Abstract
A novel micromachined comb-gimbal gyroscope is presented, which is excited by electrostatic forces and its Coriolis acceleration induced torsional motion is read out capacitively. Since electrostatic comb driving and DRIE (deep reactive ion etching) technology are adopted, the large driving amplitude and higher sensitivity of the gyroscope can be achieved. Driving mode and sensing mode working in different planes may prevent mechanical coupling. Characteristic analysis results obtained from simulation show that when the driving mode frequency equals the sensing mode frequency, the gyroscope may achieve maximal sensitivity. Then according to the matching of the driving mode frequency and detection mode frequency, the structure dimensions of the gyroscope are optimized using the finite element method (FEM). Finally, an equivalent circuit model of the gyroscope is derived, which is available for detection oscillating properties analysis and also enables the simulation of the sensor with the interfacing electronics.
Keywords
Coriolis force; equivalent circuits; finite element analysis; gyroscopes; microsensors; modelling; sensitivity analysis; Coriolis acceleration induced torsional motion; FEM; capacitive readout; comb-gimbal micromachined gyroscope; deep RIE technology; detection oscillating properties analysis; driving mode frequency; electrostatic comb driving; electrostatic forces; equivalent circuit model; finite element method; reactive ion etching; sensing mode frequency; sensitivity; Acceleration; Analytical models; Circuit simulation; Electrostatics; Equivalent circuits; Etching; Finite element methods; Frequency; Gyroscopes; Optimization methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2002. Proceedings of IEEE
Print_ISBN
0-7803-7454-1
Type
conf
DOI
10.1109/ICSENS.2002.1037266
Filename
1037266
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