DocumentCode

3827143

Title

Aerospace giant brings wafer-scale integration down to earth

Volume

25

Issue

9

fYear

1979

fDate

9/1/1979 12:00:00 AM

Firstpage

597

Journal_Title

Electronics and Power

Publisher

iet

ISSN

0013-5127

Type

jour

DOI

10.1049/ep.1979.0346

Filename

5197865