DocumentCode :
3827143
Title :
Aerospace giant brings wafer-scale integration down to earth
Volume :
25
Issue :
9
fYear :
1979
fDate :
9/1/1979 12:00:00 AM
Firstpage :
597
Journal_Title :
Electronics and Power
Publisher :
iet
ISSN :
0013-5127
Type :
jour
DOI :
10.1049/ep.1979.0346
Filename :
5197865
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3827143
