Title :
Thermo-mechanical stress analysis for an integrated passive resonant module
Author :
Lee, Seung-Yo ; Odendaal, W.G. ; van Wyk, J.D.
Author_Institution :
Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
In this paper, thermo-mechanical stress analysis for a series resonant passive integrated power electronic module (IPEM) is presented. The passive IPEM has in the past been implemented as a resonant tank in resonant DC-DC converters. It has some merits for reducing the total volume of the resonant converter system and improving manufacturability, but this integration process increases the complexity of the thermal and mechanical behavior of the structure due to interactive heating of the module layers and mechanical inter-layer stresses. It is therefore essential to investigate the thermo-mechanical behavior of an IPEM to ensure reliable operation. This paper presents a 3-dimensional thermo-mechanical model based on finite-element modeling (FEM) using I-DEAS software. Results of the thermal analysis and the associated thermal stress analysis are also discussed.
Keywords :
DC-DC power convertors; circuit analysis computing; finite element analysis; passive networks; power engineering computing; resonant power convertors; thermal analysis; 3-dimensional thermo-mechanical model; I-DEAS software; finite-element modeling; integrated passive resonant power electronic module; integration process; manufacturability; resonant DC-DC converters; resonant tank; thermo-mechanical stress analysis; Ceramics; Dielectric substrates; Finite element methods; Impedance; Performance analysis; Power electronics; Prototypes; Resonance; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Industry Applications Conference, 2002. 37th IAS Annual Meeting. Conference Record of the
Conference_Location :
Pittsburgh, PA, USA
Print_ISBN :
0-7803-7420-7
DOI :
10.1109/IAS.2002.1043770