• DocumentCode
    383330
  • Title

    300 mm ultra thin SOI material using Smart-Cut® technology

  • Author

    Auberton-Hervé, A.J. ; Maleville, C.

  • Author_Institution
    SOITEC SA, Crolles, France
  • fYear
    2002
  • fDate
    7-10 Oct 2002
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    We discuss a new ultra thin 300 mm SOI material, Unibond(R), which fulfills industry requirements in terms of uniformity, quality and availability.
  • Keywords
    ion implantation; oxidation; polishing; semiconductor technology; silicon-on-insulator; 300 mm; low energy implantation; oxidation; polishing; quality; smart-cut technology; ultra thin SOI material; uniformity; Ion implantation; Oxidation; Semiconductor device fabrication; Silicon on insulator technology; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, IEEE International 2002
  • Print_ISBN
    0-7803-7439-8
  • Type

    conf

  • DOI
    10.1109/SOI.2002.1044396
  • Filename
    1044396
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=383330