DocumentCode
3846762
Title
Performance and Area Scaling Benefits of FD-SOI Technology for 6-T SRAM Cells at the 22-nm Node
Author
Changhwan Shin;Min Hee Cho;Yasumasa Tsukamoto;Bich-Yen Nguyen;Carlos Mazure;Borivoje Nikolic;Tsu-Jae King Liu
Author_Institution
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
Volume
57
Issue
6
fYear
2010
Firstpage
1301
Lastpage
1309
Abstract
The performance and threshold voltage variability of fully depleted silicon-on-insulator (FD-SOI) MOSFETs are compared against those of conventional bulk MOSFETs via 3-D device simulation with atomistic doping profiles. Compact (analytical) modeling is then used to estimate six-transistor SRAM cell performance metrics (i.e., read and write margins, and read current) at the 22 nm CMOS technology node. The dependences of these metrics on cell ratio, pull-up ratio, and operating voltage are analyzed for FD-SOI versus bulk SRAM cells. Iso-area and iso-yield comparisons are then made to determine the yield and cell-area benefits of FD-SOI technology, respectively. Finally, the minimum operating voltages required for FD-SOI and bulk SRAM cells to meet the six-sigma yield requirement are compared.
Keywords
"Random access memory","Logic gates","MOSFETs","Measurement","Doping","Semiconductor process modeling","Analytical models"
Journal_Title
IEEE Transactions on Electron Devices
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2010.2046070
Filename
5447684
Link To Document