• DocumentCode
    3846762
  • Title

    Performance and Area Scaling Benefits of FD-SOI Technology for 6-T SRAM Cells at the 22-nm Node

  • Author

    Changhwan Shin;Min Hee Cho;Yasumasa Tsukamoto;Bich-Yen Nguyen;Carlos Mazure;Borivoje Nikolic;Tsu-Jae King Liu

  • Author_Institution
    Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
  • Volume
    57
  • Issue
    6
  • fYear
    2010
  • Firstpage
    1301
  • Lastpage
    1309
  • Abstract
    The performance and threshold voltage variability of fully depleted silicon-on-insulator (FD-SOI) MOSFETs are compared against those of conventional bulk MOSFETs via 3-D device simulation with atomistic doping profiles. Compact (analytical) modeling is then used to estimate six-transistor SRAM cell performance metrics (i.e., read and write margins, and read current) at the 22 nm CMOS technology node. The dependences of these metrics on cell ratio, pull-up ratio, and operating voltage are analyzed for FD-SOI versus bulk SRAM cells. Iso-area and iso-yield comparisons are then made to determine the yield and cell-area benefits of FD-SOI technology, respectively. Finally, the minimum operating voltages required for FD-SOI and bulk SRAM cells to meet the six-sigma yield requirement are compared.
  • Keywords
    "Random access memory","Logic gates","MOSFETs","Measurement","Doping","Semiconductor process modeling","Analytical models"
  • Journal_Title
    IEEE Transactions on Electron Devices
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2010.2046070
  • Filename
    5447684