• DocumentCode
    3846854
  • Title

    Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response

  • Author

    Świa̧tczak;Bjorn Vermeersch;Gilbert De Mey;Bogusław Wiȩcek;Jȩdrzej ;Mariusz Felczak

  • Author_Institution
    Institute of Electronics, Technical University of Lodz, lodz, Poland
  • Volume
    33
  • Issue
    2
  • fYear
    2010
  • fDate
    6/1/2010 12:00:00 AM
  • Firstpage
    260
  • Lastpage
    266
  • Abstract
    In this paper, it is outlined how thermal AC measurements can be carried out on a resistor deposited on an electronic substrate. The AC approach enables us to limit ourselves to phase measurements which can be carried out with a much higher precision than amplitude measurements. It will also be demonstrated how the phase measurements at a well-chosen frequency can be used to measure the heat transfer coefficient.
  • Keywords
    "Heat transfer","Transient response","Phase measurement","Temperature","Thermal resistance","Electronic packaging thermal management","Frequency measurement","Resistors","Numerical simulation","Electronic circuits"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2010.2046326
  • Filename
    5466121
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3846854