Title : 
Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response
         
        
            Author : 
Świa̧tczak;Bjorn Vermeersch;Gilbert De Mey;Bogusław Wiȩcek;Jȩdrzej ;Mariusz Felczak
         
        
            Author_Institution : 
Institute of Electronics, Technical University of Lodz, lodz, Poland
         
        
        
        
        
            fDate : 
6/1/2010 12:00:00 AM
         
        
        
        
            Abstract : 
In this paper, it is outlined how thermal AC measurements can be carried out on a resistor deposited on an electronic substrate. The AC approach enables us to limit ourselves to phase measurements which can be carried out with a much higher precision than amplitude measurements. It will also be demonstrated how the phase measurements at a well-chosen frequency can be used to measure the heat transfer coefficient.
         
        
            Keywords : 
"Heat transfer","Transient response","Phase measurement","Temperature","Thermal resistance","Electronic packaging thermal management","Frequency measurement","Resistors","Numerical simulation","Electronic circuits"
         
        
            Journal_Title : 
IEEE Transactions on Components and Packaging Technologies
         
        
        
        
        
            DOI : 
10.1109/TCAPT.2010.2046326