DocumentCode
384820
Title
A novel electro-thermally driven bi-directional microactuator
Author
Liao, KO-Min ; Chueh, Chin-Chiang ; Chen, Ronashun
Author_Institution
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2002
fDate
2002
Firstpage
267
Lastpage
274
Abstract
In this study, an electrothermal microactuator for bi-directional motion is designed and fabricated using surface micromachining processes. The in-plane horizontal motion of the device is based on the uneven thermal expansion of the structure with different beam widths, while the out-of-plane vertical motion is driven by electrostatic force through using the principle of lever to allow bending the beam upward and to enlarge the tip deflection. This microactuator has the advantages of CMOS-compatible, low operation voltage, and simple fabrication processes. The expected applications for the proposed devices are micro switches, micromanipulators, micro optical tweezers, etc. Finite element method (FEM) analysis is used to simulate the electrothermomechanical behavior of the device and to demonstrate the feasibility of our design for bi-directional motions under different applied voltages. The relationship between the applied voltage and the displacement is found, and the performance of the presented design has been examined. Finally, the deviation between simulated and measured results is discussed.
Keywords
digital simulation; electronic engineering computing; finite element analysis; microactuators; micromachining; thermal analysis; CMOS-compatible low-operation voltage; FEA; FEM; electrostatic force; electrothermally-driven bi-directional microactuator; electrothermomechanical behavior; finite element method; in-plane horizontal motion; micro optical tweezers; micro switches; micromanipulators; out-of-plane vertical motion; surface micromachining processes; tip deflection enlargement; Bidirectional control; Electrostatics; Electrothermal effects; Low voltage; Microactuators; Micromachining; Optical device fabrication; Optical switches; Thermal expansion; Thermal force;
fLanguage
English
Publisher
ieee
Conference_Titel
Micromechatronics and Human Science, 2002. MHS 2002. Proceedings of 2002 International Symposium on
Print_ISBN
0-7803-7611-0
Type
conf
DOI
10.1109/MHS.2002.1058045
Filename
1058045
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