DocumentCode
3849064
Title
SiC Schottky Diodes for Harsh Environment Space Applications
Author
Philippe Godignon;Xavier Jorda;Miquel Vellvehi;Xavier Perpina;Viorel Banu;Demetrio Lopez;Juan Barbero;Pierre Brosselard;Silvia Massetti
Author_Institution
Instituto de Microelectrò
Volume
58
Issue
7
fYear
2011
Firstpage
2582
Lastpage
2590
Abstract
This paper reports on the fabrication technology and packaging strategy for 300-V 5-A silicon carbide Schottky diodes with a wide temperature operation range capability (between -170 °C and 300 °C). These diodes have been designed for harsh environment space applications such as inner Solar System exploration probes. Different endurance tests have been performed to evaluate the diode behavior when working at a high temperature and under severe thermal cycling conditions (ranged from -170 °C to 270 °C). The radiation hardness capability has been also tested. It has been found that the hermeticity of the package in a neutral atmosphere is a key aspect to avoid an electrical parameter drift. Moreover, the use of gold metallization and gold wire bonds on the anode allows reducing the diode surface and bonding degradation when compared to Al-containing technology. On the back-side cathode contact, the Ti/Ni/Au metallization and AuGe combination have shown a very good behavior. As a result, the manufactured diodes demonstrated high stability for a continuous operation at 285 °C.
Keywords
"Schottky diodes","Temperature measurement","Stress","Gold","Silicon carbide","Metallization"
Journal_Title
IEEE Transactions on Industrial Electronics
Publisher
ieee
ISSN
0278-0046
Type
jour
DOI
10.1109/TIE.2010.2080252
Filename
5585749
Link To Document