• DocumentCode
    3849064
  • Title

    SiC Schottky Diodes for Harsh Environment Space Applications

  • Author

    Philippe Godignon;Xavier Jorda;Miquel Vellvehi;Xavier Perpina;Viorel Banu;Demetrio Lopez;Juan Barbero;Pierre Brosselard;Silvia Massetti

  • Author_Institution
    Instituto de Microelectrò
  • Volume
    58
  • Issue
    7
  • fYear
    2011
  • Firstpage
    2582
  • Lastpage
    2590
  • Abstract
    This paper reports on the fabrication technology and packaging strategy for 300-V 5-A silicon carbide Schottky diodes with a wide temperature operation range capability (between -170 °C and 300 °C). These diodes have been designed for harsh environment space applications such as inner Solar System exploration probes. Different endurance tests have been performed to evaluate the diode behavior when working at a high temperature and under severe thermal cycling conditions (ranged from -170 °C to 270 °C). The radiation hardness capability has been also tested. It has been found that the hermeticity of the package in a neutral atmosphere is a key aspect to avoid an electrical parameter drift. Moreover, the use of gold metallization and gold wire bonds on the anode allows reducing the diode surface and bonding degradation when compared to Al-containing technology. On the back-side cathode contact, the Ti/Ni/Au metallization and AuGe combination have shown a very good behavior. As a result, the manufactured diodes demonstrated high stability for a continuous operation at 285 °C.
  • Keywords
    "Schottky diodes","Temperature measurement","Stress","Gold","Silicon carbide","Metallization"
  • Journal_Title
    IEEE Transactions on Industrial Electronics
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.2010.2080252
  • Filename
    5585749