DocumentCode :
3849064
Title :
SiC Schottky Diodes for Harsh Environment Space Applications
Author :
Philippe Godignon;Xavier Jorda;Miquel Vellvehi;Xavier Perpina;Viorel Banu;Demetrio Lopez;Juan Barbero;Pierre Brosselard;Silvia Massetti
Author_Institution :
Instituto de Microelectrò
Volume :
58
Issue :
7
fYear :
2011
Firstpage :
2582
Lastpage :
2590
Abstract :
This paper reports on the fabrication technology and packaging strategy for 300-V 5-A silicon carbide Schottky diodes with a wide temperature operation range capability (between -170 °C and 300 °C). These diodes have been designed for harsh environment space applications such as inner Solar System exploration probes. Different endurance tests have been performed to evaluate the diode behavior when working at a high temperature and under severe thermal cycling conditions (ranged from -170 °C to 270 °C). The radiation hardness capability has been also tested. It has been found that the hermeticity of the package in a neutral atmosphere is a key aspect to avoid an electrical parameter drift. Moreover, the use of gold metallization and gold wire bonds on the anode allows reducing the diode surface and bonding degradation when compared to Al-containing technology. On the back-side cathode contact, the Ti/Ni/Au metallization and AuGe combination have shown a very good behavior. As a result, the manufactured diodes demonstrated high stability for a continuous operation at 285 °C.
Keywords :
"Schottky diodes","Temperature measurement","Stress","Gold","Silicon carbide","Metallization"
Journal_Title :
IEEE Transactions on Industrial Electronics
Publisher :
ieee
ISSN :
0278-0046
Type :
jour
DOI :
10.1109/TIE.2010.2080252
Filename :
5585749
Link To Document :
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