DocumentCode :
3849780
Title :
Materials processing and reliability of 3D interconnects
Volume :
58
Issue :
2
fYear :
2011
Firstpage :
579
Lastpage :
580
Journal_Title :
IEEE Transactions on Electron Devices
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2011.2107450
Filename :
5697318
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3849780
