Title :
Wafer fusion: materials issues and device results
Author :
A. Black;A.R. Hawkins;N.M. Margalit;D.I. Babic;A.L. Holmes;Y.-L. Chang;P. Abraham;J.E. Bowers;E.L. Hu
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device results and characterizations of the fused interface between several groups of materials.
Keywords :
"Semiconductor materials","Optical materials","Conducting materials","Wafer bonding","Lattices","Thermal resistance","Mirrors","Substrates","Wavelength division multiplexing","Semiconductor devices"
Journal_Title :
IEEE Journal of Selected Topics in Quantum Electronics
DOI :
10.1109/2944.640648
