Highly conformal deposition of copper nanocylinders uniformly electrodeposited in nanoporous alumina template for ordered catalytic applications

Electrodeposition of copper in cylindrical pores of a nanoporous alumina template is investigated. An electrochemical deposition mode with pulsed current is used in an aqueous copper sulphate solution. The evolution of the deposition quality in terms of height, shape and filling ratio is analysed against several parameters: the intensity, duration and number of pulses. Systematic observations and analyses using scanning electron microscopy are carried out. Statistical and quantitative treatment has been performed. A high filling ratio of more than 90%, the height control and a conformal shape of the copper nanoparticles have been achieved.