Title : 
Timing window applications in UltraSPARC-IIIi™ microprocessor design
         
        
            Author : 
Chen, Rita Yu ; Yip, Paul ; Konstadinidis, Georgios ; Demas, Andrew ; Klass, Fabian ; Mains, Rob ; Schmitt, Margaret ; Bistry, Dina
         
        
            Author_Institution : 
Sun Microsystems Inc., Sunnyvale, CA, USA
         
        
        
        
        
        
            Abstract : 
This paper presents two timing window methodologies used in UltraSPARC-IIIi™ microprocessor design. They have improved the accuracy of timing and noise analysis. In timing analysis, timing windows are applied to calculate effective Miller factors of coupling nets; in noise analysis, they are applied to waive false noise violations. Results show that by using timing windows in timing analysis, 72% of the CPU-level nets have more accurate Miller factors. Thus, it reduces the number of false timing paths. During the development of this application, a simple and practical convergence rule is defined to stop the iteration. Also, the timing window application on noise analysis has identified 42% of the CPU-level noise violations which can be waived in UltraSPARC-IIIi™ chip. This significantly improved the productivity of the design.
         
        
            Keywords : 
integrated circuit design; integrated circuit noise; microprocessor chips; network analysis; timing; CPU-level nets; CPU-level noise violations; UltraSPARC-IIIi microprocessor design; convergence rule; coupling nets; design productivity; effective Miller factors; false noise violations; false timing paths; iteration; noise analysis; timing analysis; timing window methodologies; Application software; Capacitance; Delay; Equations; Microprocessors; Switches; Time measurement; Timing; Very large scale integration; Voltage;
         
        
        
        
            Conference_Titel : 
Computer Design: VLSI in Computers and Processors, 2002. Proceedings. 2002 IEEE International Conference on
         
        
        
            Print_ISBN : 
0-7695-1700-5
         
        
        
            DOI : 
10.1109/ICCD.2002.1106764