DocumentCode :
385662
Title :
Fitted Elmore delay: a simple and accurate interconnect delay model
Author :
Abou-Seido, Arif Ishaq ; Nowak, Brian ; Chu, Chris
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2002
fDate :
2002
Firstpage :
422
Lastpage :
427
Abstract :
In this paper, we present a new interconnect delay model called fitted Elmore delay (FED). FED is generated by approximating Hspice delay data using a curve fitting technique. The functional form used in curve fitting is derived based on the Elmore delay model. Thus, our model has all the advantages of the Elmore delay model. It has a closed form expression as simple as the Elmore delay model and is extremely efficient to compute. Interconnect optimization with respect to design parameters can also be done as easily as in the Elmore delay model. In fact, most previous algorithms and programs based on the Elmore delay model can use our model without much change. Most importantly, FED is significantly more accurate than the Elmore delay model. The maximum error in delay estimation is at most 2% for our model, compared to 8.5% for the scaled Elmore delay model. The average error is less than 0.8%. We also show that FED can be more than 10 times more accurate than the Elmore delay model when applied to wire sizing.
Keywords :
SPICE; VLSI; circuit optimisation; curve fitting; delay estimation; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; Elmore delay model; Hspice delay data approximation; VLSI; average error; closed form expression; curve fitting technique; fitted Elmore delay; interconnect delay model; interconnect optimization; maximum error; wire sizing; Capacitance; Circuit synthesis; Curve fitting; Delay estimation; Design optimization; High level synthesis; Integrated circuit interconnections; Logic; Very large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 2002. Proceedings. 2002 IEEE International Conference on
ISSN :
1063-6404
Print_ISBN :
0-7695-1700-5
Type :
conf
DOI :
10.1109/ICCD.2002.1106806
Filename :
1106806
Link To Document :
بازگشت