Title :
Low Cost MMIC Insertion Using Thick Film Processing
Author :
Bettner, A. ; Hundley, B. ; Salisbury, P.
Abstract :
Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
Keywords :
Capacitors; Costs; Glass; MMICs; Microwave integrated circuits; Nonhomogeneous media; Power transmission lines; Resistors; Thick film circuits; Thick films;
Conference_Titel :
Microwave and Millimeter-Wave Monolithic Circuits
DOI :
10.1109/MCS.1987.1114532
