DocumentCode
3861037
Title
Thermal parameters measurement method of electronics materials
Author
Z. Suszynski;M. Malinski;L. Bychto
Author_Institution
Tech. Univ. of Koszalin, Poland
Volume
21
Issue
3
fYear
1998
Firstpage
424
Lastpage
433
Abstract
The fast and precise photoacoustic methods of determination of all thermal parameters and additionally the optical absorption coefficient in the case of nonopaque solid state materials used in the electronic industry are presented. The procedures that allow one to determine the thermal diffusivity, thermal effusivity, thermal conductivity and specific heat of any material are presented. Both methods (for opaque and nonopaque material) are based on a comparison of thermal impedance frequency phase and amplitude characteristics of the samples with pattern characteristics. In the case of opaque materials they are the functions of thermal material parameters and the frequency of modulation. For nonopaque materials pattern characteristics are functions of universal and absolute arguments. Experimental results illustrating the procedures are presented and discussed for the following materials: silicon, copper, brass, and epoxy molding compound Hysol MG-40F-R.
Keywords
"Conducting materials","Optical materials","Thermal conductivity","Absorption","Solid state circuits","Electronics industry","Impedance","Frequency modulation","Silicon","Copper"
Journal_Title
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.725206
Filename
725206
Link To Document