Technical theme topics [Introduction]

Ultimately, the victims of EMI are integrated circuits used in the construction of electronic controllers, memories etc. An understanding of how such components are designed and respond to EMI can bring significant benefits to designers and users who aim to achieve EMC. The current theme is thus EMC and 3D-ICs where we explore the issues arising from the integration of ICs into three-dimensional structures and the EMC problems arising from such developments. The joint paper by Sicard et al brings together some of the leading experts in the world to present a comprehensive and up-to-date review of the issues involved. In this issue, Part I of the paper is presented covering the more general aspects of the topic.