Title :
Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I
Author :
Etienne Sicard;Wu Jianfei;R. J. Shen;Er-Ping Li;En-Xiao Liu;J. Kim;Jonghyun Cho;Madhavan Swaminathan
Author_Institution :
INSA/GEI, Toulouse, France
Abstract :
Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.
Keywords :
"Electromagnetic compatibility","Three-dimensional displays","Electromagnetic interference","Consumer electronics","Integrated circuit interconnections","Couplings"
Journal_Title :
IEEE Electromagnetic Compatibility Magazine
DOI :
10.1109/MEMC.2015.7407186
