• DocumentCode
    3861217
  • Title

    Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

  • Author

    Etienne Sicard;Wu Jianfei;R. J. Shen;Er-Ping Li;En-Xiao Liu;J. Kim;Jonghyun Cho;Madhavan Swaminathan

  • Author_Institution
    INSA/GEI, Toulouse, France
  • Volume
    4
  • Issue
    4
  • fYear
    2015
  • Firstpage
    79
  • Lastpage
    89
  • Abstract
    Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.
  • Keywords
    "Electromagnetic compatibility","Three-dimensional displays","Electromagnetic interference","Consumer electronics","Integrated circuit interconnections","Couplings"
  • Journal_Title
    IEEE Electromagnetic Compatibility Magazine
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2015.7407186
  • Filename
    7407186
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3861217