• DocumentCode
    3861506
  • Title

    An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

  • Author

    S. Haque; Kun Xing; Ray-Lee Lin;C.T.A. Suchicital; Guo-Quan Lu;D.J. Nelson;D. Borojevic;F.C. Lee

  • Author_Institution
    Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
  • Volume
    22
  • Issue
    2
  • fYear
    1999
  • Firstpage
    136
  • Lastpage
    144
  • Abstract
    Power electronics building blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double what could be achieved with commercially packaged devices of the same rating.
  • Keywords
    "Electronics packaging","Power electronics","Power system protection","Inverters","Circuit topology","Prototypes","Integrated circuit interconnections","Integrated circuit packaging","Semiconductor device packaging","Packaging machines"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.763184
  • Filename
    763184