Abstract :
This paper presents simulation of new cooling fins equipped with heat pipes for high power and high temperature electronic circuits and devices. Highly conductive heat pipe provides more effective energy dissipation to the ambient. Calculated thermal resistance shows quantitatively the improvement of cooling conditions for fins with heat pipe in comparison to traditional device.
Keywords :
"Steady-state","Electronics cooling","Electronic circuits","Heat transfer","Heat sinks","Thermal conductivity","Temperature","Circuit simulation","Electronic packaging thermal management","Thermal force"
