• DocumentCode
    3863135
  • Title

    Interconnected capacitors for effective power delivery noise suppression across domains

  • Author

    Sameer Shekhar;Amit K. Jain

  • Author_Institution
    Client Computing Group, Intel Corporation, Hillsboro, Oregon, USA
  • fYear
    2015
  • Firstpage
    7
  • Lastpage
    10
  • Abstract
    Optimal power delivery network design relies on decoupling capacitors that consume significant package and board real estate, which is becoming scarce due to shrinking chip sizes and overall system form factors. This paper addresses noise reduction via capacitor interconnection between different voltage domains to leverage decoupling capacitors across domains. Novel structures that integrate decoupling and interconnection capacitor are then proposed. The complete solution delivers more than 40% noise reduction per unit capacitor area. Simulation results are provided for illustration.
  • Keywords
    "Capacitors","Capacitance","Substrates","Noise reduction","Correlation","Geometry"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
  • Print_ISBN
    978-1-5090-0038-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2015.7347118
  • Filename
    7347118