• DocumentCode
    3863144
  • Title

    An electromagnetic model for back-drilled vias

  • Author

    Aosheng Rong;Andreas C. Cangellaris;Feng Ling

  • Author_Institution
    Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 306 N. Wright St., 61801, U.S.A.
  • fYear
    2015
  • Firstpage
    47
  • Lastpage
    50
  • Abstract
    The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.
  • Keywords
    "Mathematical model","Substrates","Scattering","Metallization","Apertures","Electromagnetic modeling","Electromagnetics"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
  • Print_ISBN
    978-1-5090-0038-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2015.7347127
  • Filename
    7347127
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3863144