• DocumentCode
    3863214
  • Title

    Heterogeneous integration through direct wafer bonding

  • Author

    M. Eibelhuber;N. Razek;V. Dragoi;C. Fl?tgen;M. Wimplinger;T. Uhrmann

  • Author_Institution
    EVGroup, 4782 St. Florian am Inn
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Recent developments in direct wafer bonding make this technology a versatile tool for heterogeneous integration. Advances in process flows and equipment technology trigger new types of application schemes for novel types of device architecture.
  • Keywords
    "Surface treatment","Wafer bonding","Bonding","Compounds","Substrates","Performance evaluation","Rough surfaces"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412399
  • Filename
    7412399
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3863214