Title :
Heterogeneous integration through direct wafer bonding
Author :
M. Eibelhuber;N. Razek;V. Dragoi;C. Fl?tgen;M. Wimplinger;T. Uhrmann
Author_Institution :
EVGroup, 4782 St. Florian am Inn
Abstract :
Recent developments in direct wafer bonding make this technology a versatile tool for heterogeneous integration. Advances in process flows and equipment technology trigger new types of application schemes for novel types of device architecture.
Keywords :
"Surface treatment","Wafer bonding","Bonding","Compounds","Substrates","Performance evaluation","Rough surfaces"
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
DOI :
10.1109/EPTC.2015.7412399
