• DocumentCode
    3863431
  • Title

    Dielectric breakdown of polypropylene film in high temperature region

  • Author

    M. Nagao;M. Kosaki;I. Sugiyama;M. Ieda

  • Author_Institution
    School of Electrical and Electronic Engineering, Toyohashi University of Technology, Tempaku, 440 JAPAN
  • fYear
    1984
  • fDate
    6/1/1984 12:00:00 AM
  • Firstpage
    182
  • Lastpage
    185
  • Abstract
    Dielectric breakdown of polypropylene film with d.c. voltage was studied mainly in high temperature region. Above room temperature a thermal breakdown process is considered as a possible breakdown mechanism for the epoxy resin molded specimen and a thermal breakdown process combined with an electromechanical deformation for the non molded one.
  • Keywords
    "Electric breakdown","Temperature measurement","Films","Temperature dependence","Breakdown voltage","Epoxy resins","Electric fields"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1984 IEEE International Conference on
  • Print_ISBN
    978-1-5090-3124-5
  • Type

    conf

  • DOI
    10.1109/EIC.1984.7465174
  • Filename
    7465174
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3863431