Title :
Dielectric breakdown of polypropylene film in high temperature region
Author :
M. Nagao;M. Kosaki;I. Sugiyama;M. Ieda
Author_Institution :
School of Electrical and Electronic Engineering, Toyohashi University of Technology, Tempaku, 440 JAPAN
fDate :
6/1/1984 12:00:00 AM
Abstract :
Dielectric breakdown of polypropylene film with d.c. voltage was studied mainly in high temperature region. Above room temperature a thermal breakdown process is considered as a possible breakdown mechanism for the epoxy resin molded specimen and a thermal breakdown process combined with an electromechanical deformation for the non molded one.
Keywords :
"Electric breakdown","Temperature measurement","Films","Temperature dependence","Breakdown voltage","Epoxy resins","Electric fields"
Conference_Titel :
Electrical Insulation, 1984 IEEE International Conference on
Print_ISBN :
978-1-5090-3124-5
DOI :
10.1109/EIC.1984.7465174
